RMB (CNY) 18,000 to 25,000 | Power Semiconductor Die Bond Process Engineer Working Place: Hangzhou Office a...
Power Semiconductor Die Bond Process Engineer
Working Place: Hangzhou
Office address: No. 18, Hengnuo Road, Xincheng Town, Xiuzhou Industrial Park, Jiaxing City, Zhejiang Province
Job Type: Full Time
Industry & Field: Semiconductors
Vacancies: 1
Salary: Monthly Salary: RMB (CNY) 18,000 to 25,000
Contact Name: Eva
Refresh Date: Aug. 17, 2022
Expiration Date: Aug. 23, 2022
Job Description:
Requirements
1) University graduated major in Physics, Chemistry, mechanical engineering, Electronics engineering, material science or equivalent
2) Min 3 years' experience in Discrete or Mo...