RMB (CNY) 18,000 to 25,000| Power Semiconductor Die Bond Process Engineer
Office Address: No. 18, Hengnuo R...Power Semiconductor Die Bond Process Engineer
Office Address: No. 18, Hengnuo Road, Xincheng Town, Xiuzhou Industrial Park, Jiaxing City, Zhejiang Province
Job Type: Full Time
Industry & Field: Semiconductors
Vacancies: 1
Salary: Monthly Salary: RMB (CNY) 18,000 to 25,000
Contact Name: Eva
Refresh Date: Jul. 7, 2022
Expiration Date: Aug. 23, 2022
Job Description:
Requirements
1) University graduated major in Physics, Chemistry, mechanical engineering, Electronics engineering, material science or equivalent
2) Min 3 years' experience in Discrete or Module semiconductor die attach or SMT engineering using ASM, ESEC, Yamaha(SMT), Datacon, others die bonder or SMT machine experience
3) Solder and epoxy material properties and its reliability failures knowledge
4) JMP, Minitab DOE or other statistical analysis skill will get advantages
5) Be familiar with design, process FMEA, Control plan generation
6) In-depth knowledge of power electronic packages and processes
7) Fundamental understanding of package design and material properties
8) Knowledge of power packages processes
9) Understanding of semiconductor material properties and their influence on semiconductor device behavior
10) Able to understand thermo/mechanical simulation and JMP data analysis tools is strongly desired
11) Excellent interpersonal, verbal, and written English communication skills
12) Ability to demonstrate great attention to detail
13) Are a proven self-starter
Qualifications & Requirements:
Job description
1) Responsible from design review of new products, participate Package
and substrate(Lead frame and DBC) design review, optimize design, process characterization, generate related spec and work instruction, to be owner of qualification and customers samples to complete product qualification, initial training of operation
2) Lead potential failure modes review to define RPN into DFEMA and find counter measure to optimize design for yield, cost, quality, reliability, manufacturability, cycle time
3) Lead supplier to design required tools and jig such like magazine, spanker, stencil, epoxy dispensing nozzle
4) Characterize and generate report for solder, epoxy, SMT process against failure modes and key parameters of output variables according to D/PFMEA
5) Optimize process recipe, parameters, tools, jigs to meet die attach cost, quality, yield, UPH, reliability, manufacturability to hands over to operation department
6) Validate design rule by process characterization
7) Generate process quality specs, recipe, D/PFMEA, Control plan, work instruction to train operation
8) Resolve technical issues from characterization, qualification, and customer samples
9) Owner of correspond process to meet required process success criteria
10) Generate new equipment PO spec leading cross functional team from operation and support department
Benefits & Welfare:
Pay five insurance and one housing fund, provide accommodation, shuttle bus, canteen,enjoy all the holidays and benefits stipulated
