| Job Description
- Process development fo new package/product, especially for mo...Job Description
- Process development fo new package/product, especially for molding process/materials
- Process optimisation, specification, & project managment
- Master the technology trend in molding process etc
- Support on probleming solving during new product ramp up.
Work Experience
>2 year working experience;
Any semiconductor manufacturing working experience is prefered
Job Requirements & Key Skills
- Be good at spoken & written English and very good communication skills
- CET 4 or 6 Certificate
- Foundamentals about IC packaging, hand-on experience / skills on molding process/material
Professional / training Requirement
1. Manufacturing process & technology Training, hand-on experience / skill on molding/cropping etc process
2. DOE, FMEA, SPC, FA skill
3. Project management skill
Shenzhen futian
| 深圳赛意法微电子有限公司
ID:226922 | 2015/10/08/11点
